Intel will build chips for Qualcomm as part of its ambitious foundry plans

Earlier at this time, Intel unveiled detailed plans for its future chip expertise, describing the way it plans to catch rivals TSMC and Samsung by 2025. It additionally revealed that it will begin constructing chips for Qualcomm utilizing its first new transistor structure in a decade. In addition, the corporate will provide its packaging tech to Amazon for its AWS knowledge facilities. 

Intel’s largest expertise leap will occur in 2024 when the corporate ushers in its RibbonFET and PowerVia expertise (beneath). RibbonFET will be a brand new variety of “gate-all-around” transistor delivering sooner switching speeds in a smaller footprint. PowerVia, in the meantime, will be a bottom energy supply system “eliminating the need for power routing on the front side of the wafer” and making chips extra environment friendly.

Intel will manufacture chips for Qualcomm utilizing that 20A course of expertise, although it did not say which merchandise it could produce or when. Qualcomm at present makes use of a number of foundries to build its Snapdragon processors and different chips, used primarily in smartphones and different moveable gadgets. 

CEO Pat Gelsinger first laid out Intel’s ambitious foundry plans earlier this yr as part of the corporate’s IDM 2.0 strategy, saying it could make investments $20 billion in two Arizona fab vegetation. Now, it must ship on all that if it desires to maintain constructing its own chips, not to mention merchandise for firms the scale of Qualcomm and Amazon. 

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